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ISO/IEC 30129 : 2015/Amd 1:2019現行

Information technology — Telecommunications bonding networks for buildings and other structures — Amendment 1

出版:International Organization for Standardization

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基本信息
標準編號: ISO/IEC 30129 : 2015/Amd 1:2019
標準類別:Amendment
出版單位:International Organization for Standardization
標準頁數:5
標準簡介

This International Standard specifies requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information technology (IT) and, more generally, telecommunications equipment is intended to be installed in order to a) minimise the risk to the correct function of that equipment and interconnecting cabling from electrical hazards, b) provide the telecommunications installation with a reliable signal reference – which may improve immunity from electromagnetic interference (EMI).