Describes the requirements for chemical composition for the following families of soft solder alloys: - tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; - tin-antimony; - tin-bismuth; - tin-copper, with and without silver; - tin-indium, with and without silver and bismuth; - tin-silver, with and without copper and bismuth; - tin-zinc, with and without bismuth.

Supersedes ONORM EN 29453. (01/2007)

ONORM EN ISO 9453:2007

SS EN ISO 9453 Ed. 2 (2014) - Identical

I.S. EN ISO 9453:2014 - Identical

BS EN ISO 9453:2014 - Identical

NEN EN ISO 9453:2014 - Identical

NF EN ISO 9453:2014 - Identical

NBN EN ISO 9453:2014 - Identical

NS EN ISO 9453:2014 - Identical

SN EN ISO 9453:2014 - Identical

DIN EN ISO 9453 (2014-12) - Identical

UNE EN ISO 9453:2007 - Identical

UNE EN ISO 9453:2015 - Identical