EIA JESD 22-A112:1995被替代
Moisture-induced Stress Sensitivity For Plastic Surface Mount Devices
出版：JEDEC Solid State Technology Association
專家解讀視頻
Two test methods (A112 and A113) have been developed to address the problems of moisture sensitivity of plastic surface mount devices, and moisture inside a plastic package that turns to steam and expands rapidly when the package is exposed to the high temperature of vapor phase reflow, infrared soldering, or wave soldering. Test method A112 cover the issue of moisture time that a package can be exposed to the manufacturing environment prior to reflow soldering without sustaining package damage during reflow operation. Utilizes soak conditions to represent actual moisture absorption of the package at the semiconductor factory plus actual moisture absorption of the package on the OEM factory floor.
Supersedes EIA JESD 22 (07/2004)
