IEC 60068-2-10:2005 Provides a test method for determining the extent to which electrotechnical products support mould growth and how any mould growth may affect the performance and other relevant properties of the product. Since mould growth conditions include high relative humidity, the test is applicable to electrotechnical products intended for transportation, storage and use under humid conditions over a period of some days at least. The main changes with respect to the previous edition are listed below: - Two test fungi replaced by two others - Concentration of the spores defined for each test fungus - Spores suspension in mineral salt solution additionally introduced - Pre-conditioning of the specimens by damp heat storage prescribed - Supersonic aerosolization of the spores suspension as the preferred inoculation method introduced - Duration of incubation reduced from 84 days to 56 days - Extent of mould growth grade 2 split into grade 2a and grade 2b - Detailed information on methods of inoculation given in Annex B - Annex E: flow-chart deleted It has the status of a horizontal standard in accordance with IEC Guide 104

IEC 60068-2-10 Ed. 5.0

SS EN 60068 Ed. 3 (2000) - Identical

OVE/ONORM EN 60068-2-10:2006 - Identical

NEN EN IEC 60068-2-10:2005 - Identical

PN EN 60068-2-10:2007 - Identical

SS EN 60068-2-10 Ed. 1 (2005) - Identical

UNE EN 60068-2-10:2006 - Identical

BS 2011-2.1J:1989 - Equivalent

NF EN 60068-2-10:2005 - Identical

DIN EN 60068-2-10 (2006-03) - Identical

BS EN 60068-2-10:2005 - Identical

CEI EN 60068-2-10 Ed. 1 (2006) - Identical

SS IEC 60068-2-10 Ed. 1 (2001) - Identical

NFC 20 710:1989 - Identical

UTEC 20 410:1985 - Similar

DIN IEC 60068-2-10 (1991-04) - Identical

AS 1099.2.10-1989 - Equivalent

UNE 20501-2-10:1994 - Identical

HD 323.2.10:1988 - Identical

BS 2011-2.1J:1985 - Identical

NEN 10068-2-10:1989 - Identical