
Varnish, Moisture And Fungus Resistant (For Treatment Of Communications, Electronics, And Associated Equipment) - Revision C
出版:US Military Specs/Standards/Handbooks

專家解讀視頻
Describes a varnish consisting of a para-phenyl phenol-formaldehyde resin combined with tung oil and solvents, made fungistatic by the addition of 7.0 + 1.0 percent salicylanilide or one percent copper 8-quinolinolate.
INACTIVE FOR NEW DESIGN