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MIL V 173 Revision C被替代

Varnish, Moisture And Fungus Resistant (For Treatment Of Communications, Electronics, And Associated Equipment) - Revision C

出版:US Military Specs/Standards/Handbooks

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基本信息
標(biāo)準(zhǔn)編號(hào): MIL V 173 Revision C
標(biāo)準(zhǔn)類別:Standard
出版單位:US Military Specs/Standards/Handbooks
標(biāo)準(zhǔn)頁(yè)數(shù):19
標(biāo)準(zhǔn)簡(jiǎn)介

Describes a varnish consisting of a para-phenyl phenol-formaldehyde resin combined with tung oil and solvents, made fungistatic by the addition of 7.0 + 1.0 percent salicylanilide or one percent copper 8-quinolinolate.

標(biāo)準(zhǔn)備注

INACTIVE FOR NEW DESIGN

替代本標(biāo)準(zhǔn)的新標(biāo)準(zhǔn)

ASTM D3955-04

ASTM D295-99(2004)