DIN EN 60068-2-69 (2007-11)現行
Environmental Testing - Part 2-69: Tests - Test Te: Solderability Testing Of Electronic Components For Surface Mounting Devices (smd) By The Wetting Balance Method
出版：Verband Deutscher Elektrotechniker
專家解讀視頻
Describes test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices.
Supersedes DIN IEC 60068-2-69. (11/2007) DRAFT 2014 issued in November 2014. (11/2014)
BS EN 60068-2-69:2007 - Identical
SN EN 60068-2-69:1996 - Identical
SS EN 60068-2-69 Ed. 2 (2007) - Identical
IEC 60068-2-69 Ed. 2.0 - Identical
EN 60068-2-69:2017 - Identical
BS EN 60068-2-69:2017 - Identical
I.S. EN 60068-2-69:2007 - Identical
UNE EN 60068-2-69:2007 - Identical
