DIN EN ISO 9455-17 : 2006現行
SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
出版：German Institute for Standardisation (Deutsches Institut für Normung)
專家解讀視頻
基本信息
標準編號： DIN EN ISO 9455-17 : 2006
標準類別：Standard
出版單位：German Institute for Standardisation (Deutsches Institut für Normung)
標準頁數：0
標準簡介
This standard is included in DIN DVS Handbook 196/2. Describes a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders.
