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DS EN 60749-21:2011現(xiàn)行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 21: Solderability
出版：Danish Standards
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基本信息
標(biāo)準(zhǔn)編號(hào)： DS EN 60749-21:2011
發(fā)布時(shí)間：2011/10/28 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：Danish Standards
標(biāo)準(zhǔn)頁(yè)數(shù)：32
標(biāo)準(zhǔn)簡(jiǎn)介
Defines a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
等同采用的國(guó)際標(biāo)準(zhǔn)
EN 60749-21:2011 - Identical
