IEC 60191-6 : 3.0現行
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
出版：International Electrotechnical Committee
專家解讀視頻
Provides general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It also covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.
CEI EN 60191-6 : 2011 - Identical
UTEC 96 100 : 1992 - Identical
PN EN 60191-6 : 2010 - Identical
DS EN 60191-6 : 2010 - Identical
I.S. EN 60191-6:2009 - Identical
NEN IEC 60191-6 : 2000 AMD 1 2000 - Identical
BS EN 60191-6 : 2009 - Identical
NEN EN IEC 60191-6 : 2010 - Identical
DIN EN 60191-6 : 2010 - Identical
NEN EN IEC 60191-6 : 2010 - Identical
EN 60191-6 : 2009 - Identical
DIN EN 60191-6 : 2010 - Identical
BS EN 60191-6 : 2009 - Identical
DS EN 60191-6 : 2010 - Identical
NF EN 60191-6 : 2011 - Identical
CEI EN 60191-6 : 2011 - Identical
NBN EN 60191-6 : 2010 - Identical
