IEC 60191-3A現(xiàn)行

Mechanical Standardization Of Semiconductor Devices - General Rules For The Preparation Of Outline Drawings Of Integrated Circuits - First Supplement

出版：International Electrotechnical Committee

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基本信息

標(biāo)準(zhǔn)編號(hào)： IEC 60191-3A

標(biāo)準(zhǔn)類(lèi)別：Standard

出版單位：International Electrotechnical Committee

標(biāo)準(zhǔn)頁(yè)數(shù)：11

標(biāo)準(zhǔn)簡(jiǎn)介

Deals with design procedure for dimensions of integrated circuit packages, and rules for mounting integrated circuit packages into carriers.

等同采用的國(guó)際標(biāo)準(zhǔn)

BS 3934:1965 - Similar

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