ISO/DIS 9453 (2006)被替代
Soft Solder Alloys - Chemical Compositions And Forms
出版：International Organization for Standardization
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基本信息
標準編號： ISO/DIS 9453 (2006)
標準類別：Draft
出版單位：International Organization for Standardization
標準頁數：0
標準簡介
Specifies the requirements for chemical composition for the following families of soft solder alloys:- tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;- tin-antimony;- tin-bismuth;- tin-copper, with and without silver;- tin-indium, with and without silver and bismuth;- tin-silver, with and without copper and bismuth;- tin-zinc, with and without bismuth.
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