
Environmental Testing - Part 2-69: Tests - Test Te: Solderability Testing Of Electronic Components For Surface Mounting Devices (smd) By The Wetting Balance Method
出版:Nederlands Normalisatie Instituut

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基本信息
標準編號: NEN EN IEC 60068-2-69:2007
發布時間:2007/8/1 0:00:00
標準類別:Standard
出版單位:Nederlands Normalisatie Instituut
標準頁數:25
標準簡介
Outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices.
標準備注
Supersedes NEN 10068-2-69. (07/2007)
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