IEC 60191-6-17 Ed. 1.0現行
Mechanical standardization of semiconductor devices Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
出版：International Electrotechnical Committee
專家解讀視頻
基本信息
標準編號： IEC 60191-6-17 Ed. 1.0
發布時間：2011/1/27 0:00:00
標準類別：Standard
出版單位：International Electrotechnical Committee
標準頁數：53
標準簡介
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
等同采用的國際標準
BS EN 60191-6-17:2011 - Identical
