
Handling, Packing, Shipping And Use Of Moisture/Reflow Sensitive Surface Mount Devices
出版:Institute of Printed Circuits

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基本信息
標準編號: J STD 033:2012
發布時間:2012/2/1 0:00:00
標準類別:Standard
出版單位:Institute of Printed Circuits
標準頁數:18
標準簡介
C2012 [01/02/2012]B.1 2007 [01/01/2007]B2005 [01/10/2005]
標準備注
Supersedes IPC SM 786 & EIA JEP 124. Also available in CD-ROM format. Included in IPC C 103 & IPC C 1000. (11/2010) B.1 2007 Edition is still available in German, Chinese, Russian and Italian Languages, See separate records. Jointly Published by IPC and JEDEC. (02/2012)
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