IEC/PAS 62190 Ed. 1.0被替代
Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices
出版：International Electrotechnical Committee
專家解讀視頻
The classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices.NOTE The procedures in this document may be used on packaged devices not included in the scope. The failure criteria for such packages must be agreed upon by the device supplier and the end user.
