
Temperature Cycling
出版:Joint Electronics Device Engineering Council (JEDEC)

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Provides a method for determining solid state devices capability to withstand extreme temperature cycling. Includes requirements that the worst-case load temperature must reach the specific extremes rather than just requiring that the chamber ambient temperature reach the extremes and ensures that the test specimens will reach the specified temperature extremes regardless of chamber loading.
Supersedes EIA JESD 22 (07/2004)