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EIA JESD 22-B117:2014現(xiàn)行

Solder Ball Shear

出版：JEDEC Solid State Technology Association

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基本信息
標(biāo)準(zhǔn)編號(hào)： EIA JESD 22-B117:2014
發(fā)布時(shí)間：2014/5/1 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：JEDEC Solid State Technology Association
標(biāo)準(zhǔn)頁(yè)數(shù)：22
標(biāo)準(zhǔn)簡(jiǎn)介

Defines a test method only, test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test. Acceptance criteria and qualification requirements are not defined.

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Supersedes EIA JESD 22 (07/2004)

本標(biāo)準(zhǔn)替代的舊標(biāo)準(zhǔn)

EIA JESD 22-B117:2006