DS EN 61191-3:1999被替代
Printed Board Assemblies - Part 3: Sectional Specification - Requirements For Through-Hole Mount Soldered Assemblies
出版：Danish Standards
專家解讀視頻
基本信息
標準編號： DS EN 61191-3:1999
發布時間：1999/11/8 0:00:00
標準類別：Standard
出版單位：Danish Standards
標準頁數：44
標準簡介
Specifies requirements for lead and hole solder assembly. These pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
替代本標準的新標準
等同采用的國際標準
EN 61191-3:2017 - Identical
