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IEC 60300-3-7 Ed. 1.0廢止

Dependability management Part 3-7: Application guide - Reliability stress screening of electronic hardware

出版:International Electrotechnical Committee

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基本信息
標(biāo)準(zhǔn)編號: IEC 60300-3-7 Ed. 1.0
發(fā)布時(shí)間:1999/5/31 0:00:00
標(biāo)準(zhǔn)類別:Standard
出版單位:International Electrotechnical Committee
標(biāo)準(zhǔn)頁數(shù):69
標(biāo)準(zhǔn)簡介

Serves as an application guide to a reliability stress screening process for electronic hardware. The concept, purpose and justification of the screening process are explained. The standard is intended as a guide to be used with one of the IEC reliability stress screening standards. It gives guidance in cases where it is essential that early failures be removed from the items manufactured in order to deliver them to the customer when the problems causing the early failures are solved. It gives guidance on where the reliability stress screening should be carried out, i.e. component, subsystem or system level.

替代本標(biāo)準(zhǔn)的新標(biāo)準(zhǔn)

IEC 61163-2 Ed. 1.0

IEC 61163-1 Ed. 2.0

等同采用的國際標(biāo)準(zhǔn)

JIS C 5750-3-7:2003 - Identical

CEI 56-44 Ed. 1 (2000) - Identical

BS IEC 60300-3.7:1999 - Identical

UNE 200001-3-7:2004 - Identical

PN IEC 60300-3-7:2004 - Identical

NEN IEC 60300-3-7:1999 - Identical

BIS IS 15474-1-7:2005 - Identical