IEC 61709 Ed. 1.0被替代
Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
出版：International Electrotechnical Committee
專家解讀視頻
Gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared. The reference conditions adopted are typical of the majority of applications of components in equipment (e.g. telecommunication use, data processing). In this standard it is assumed that the failure rate used under reference conditions is specific to the component i.e. it includes the effect of complexity, technology of the casing, dependence on manufacturers and the manufacturing process, etc.
BS 5760-18:1997 - Identical
CEI EN 61709 Ed. 1 (2000) - Identical
SN EN 61709:1998 - Identical
BS EN 61709:2000 - Equivalent
NEN EN IEC 61709:1998 - Identical
DIN EN 61709 (1999-01) - Similar
NF EN 61709:1998 - Identical
I.S. EN 61709:1999 - Identical
SS EN 61709 Ed. 1 (1998) - Identical
PN EN 61709:2001 - Identical
ONORM OVE EN 61709:1998 - Identical
