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IEC 60749-10 : 1.0現(xiàn)行

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 10: MECHANICAL SHOCK

出版:International Electrotechnical Committee

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基本信息
標(biāo)準(zhǔn)編號(hào): IEC 60749-10 : 1.0
發(fā)布時(shí)間:2002/4/9 0:00:00
標(biāo)準(zhǔn)類別:Standard
出版單位:International Electrotechnical Committee
標(biāo)準(zhǔn)頁(yè)數(shù):17
標(biāo)準(zhǔn)簡(jiǎn)介

Defines a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages.

本標(biāo)準(zhǔn)替代的舊標(biāo)準(zhǔn)

IEC PAS 62186 : 1.0

等同采用的國(guó)際標(biāo)準(zhǔn)

DIN EN 60749-10 : 2003 - Identical

BS EN 60749-10 : 2002 - Identical

DS EN 60749-10 : 2002 COR 1 2003 - Identical

NEN EN IEC 60749-10 : 2002 - Identical

CEI EN 60749-10 : 2004 - Identical

PN EN 60749-10 : 2004 - Identical