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IEC 60068-2-69 Ed. 1.0被替代
Environmental testing Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
出版：International Electrotechnical Committee
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標(biāo)準(zhǔn)編號(hào)： IEC 60068-2-69 Ed. 1.0
發(fā)布時(shí)間：1995/12/8 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：International Electrotechnical Committee
標(biāo)準(zhǔn)頁數(shù)：43
標(biāo)準(zhǔn)簡(jiǎn)介
Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
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