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EN 60068-2-58 : 2015 AMD 1 2018現(xiàn)行

ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)

出版：European Committee for Standards - Electrical

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基本信息
標(biāo)準(zhǔn)編號(hào)： EN 60068-2-58 : 2015 AMD 1 2018
標(biāo)準(zhǔn)類別：Standard
出版單位：European Committee for Standards - Electrical
標(biāo)準(zhǔn)頁(yè)數(shù)：0
標(biāo)準(zhǔn)簡(jiǎn)介

Gives procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.