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IEC 60068-2-54 : 2.0被替代

ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD

出版:International Electrotechnical Committee

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基本信息
標(biāo)準編號: IEC 60068-2-54 : 2.0
發(fā)布時間:2006/4/27 0:00:00
標(biāo)準類別:Standard
出版單位:International Electrotechnical Committee
標(biāo)準頁數(shù):24
標(biāo)準簡介

Applies any shape of component terminations to determine the solderability, it is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods.