Specifies tests applicable for all package types. Aims to determine whether the marks on solid state semiconductor devices will remain legible (as defined per JESD22B-114) when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process. They are suitable for use in qualification and/or process monitor testing. The mechanical shear test (tape test) is recommended as an ongoing process monitor or lot acceptance test. Electrical or mechanical rejects may be used for these tests.

Supersedes EIA JESD 22 (07/2004)

EIA JESD 22-B107:2004