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IEC 61191-1:2018 Redline現(xiàn)行

Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

出版：International Electrotechnical Committee

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基本信息
標(biāo)準(zhǔn)編號(hào)： IEC 61191-1:2018 Redline
標(biāo)準(zhǔn)類別：Redline
出版單位：International Electrotechnical Committee
標(biāo)準(zhǔn)頁(yè)數(shù)：0
標(biāo)準(zhǔn)簡(jiǎn)介

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies.

等同采用的國(guó)際標(biāo)準(zhǔn)

NEN EN IEC 61191-1:2018 - Identical

BS EN IEC 61191-1:2018 - Identical

DS/EN IEC 61191-1 : 2018 - Identical