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IEC 60664-3 Ed. 1.0被替代

Insulation coordination for equipment within low-voltage systems Part 3: Use of coatings to achieve insulation coordination of printed board assemblies

出版：International Electrotechnical Committee

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基本信息
標(biāo)準(zhǔn)編號(hào)： IEC 60664-3 Ed. 1.0
發(fā)布時(shí)間：1992/10/13 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：International Electrotechnical Committee
標(biāo)準(zhǔn)頁(yè)數(shù)：41
標(biāo)準(zhǔn)簡(jiǎn)介

Applies to rigid printed board assemblies protected by a coating of insulating material on one or both sides. Describes the requirements and test procedures. Has the status of a basic safety publication in accordance with IEC Guide 104.

替代本標(biāo)準(zhǔn)的新標(biāo)準(zhǔn)

IEC 60664-3 Ed. 2.0

等同采用的國(guó)際標(biāo)準(zhǔn)

BS 7822-3:1995 - Identical