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DS EN 60749-19:2003現(xiàn)行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 19: Die Shear Strength
出版：Danish Standards
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基本信息
標(biāo)準(zhǔn)編號(hào)： DS EN 60749-19:2003
發(fā)布時(shí)間：2010/12/19 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：Danish Standards
標(biāo)準(zhǔn)頁(yè)數(shù)：20
標(biāo)準(zhǔn)簡(jiǎn)介
Describes the integrity of materials and procedures used to attach semiconductors die to package headers or other substrates (for the purpose of this test method, the term "semiconductors die" should be taken to include passive elements).
等同采用的國(guó)際標(biāo)準(zhǔn)
EN 60749-19:2003 - Identical
