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EIA JESD 22-C100:1990廢止
High Temperature Continuity
出版：JEDEC Solid State Technology Association
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基本信息
標(biāo)準(zhǔn)編號： EIA JESD 22-C100:1990
發(fā)布時間：1990/4/1 0:00:00
標(biāo)準(zhǔn)類別：Standard
出版單位：JEDEC Solid State Technology Association
標(biāo)準(zhǔn)頁數(shù)：0
標(biāo)準(zhǔn)簡介
Determines the integrity of internal connections on solid state devices under high temperature conditions. The connections may function at room temperature, but exhibit open or high resistance at high temperature due to the effect of thermal expansion which is commonly known as "Thermal Intermittent". It is intended for n on-cavity type packages. The high temperature continuity test is considered non-destructive. It is intended for use as a 100% screen, lot acceptance, process monitor, or for qualification testing.
標(biāo)準(zhǔn)備注
Supersedes EIA JESD 22 (07/2004)
本標(biāo)準(zhǔn)替代的舊標(biāo)準(zhǔn)
