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IEC 60286-3 Ed. 4.0被替代

Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes

出版：International Electrotechnical Committee

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基本信息

標(biāo)準(zhǔn)編號(hào)： IEC 60286-3 Ed. 4.0

發(fā)布時(shí)間：2007/6/6 0:00:00

標(biāo)準(zhǔn)類別：Standard

出版單位：International Electrotechnical Committee

標(biāo)準(zhǔn)頁(yè)數(shù)：55

標(biāo)準(zhǔn)簡(jiǎn)介

It is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. It also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). It contains the following significant technical changes with respect to the previous edition: a) implementation of Type IV (adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components); b) minor revisions related to tables, figures and references.

本標(biāo)準(zhǔn)替代的舊標(biāo)準(zhǔn)

IEC 60286-3 Ed. 3.0

替代本標(biāo)準(zhǔn)的新標(biāo)準(zhǔn)

IEC 60286-3 Ed. 5.0

等同采用的國(guó)際標(biāo)準(zhǔn)

NEN EN IEC 60286-3:2007 - Identical

PN EN 60286-3:2008 - Identical

OVE/ONORM EN 60286-3:2008 - Identical

BS EN 60286-3:2007 - Identical

UNE EN 60286-3:2000 - Identical

UNE 20526-3:1996 - Identical

DIN IEC 60286-3 (1992-11) - Identical