DS EN 60749-15:2011現行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 15: Resistance To Soldering Temperature For Through-Hole Mounted Devices
出版：Danish Standards
專家解讀視頻
基本信息
標準編號： DS EN 60749-15:2011
發布時間：2011/2/24 0:00:00
標準類別：Standard
出版單位：Danish Standards
標準頁數：28
標準簡介
Defines a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
等同采用的國際標準
EN 60749-15:2010 - Identical
