Defines the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, not exceeding widths of 100 mm. Thicknesses between 0.1 mm and 1.0 mm are mainly used for stamped lead frames for integrated circuits and low power devices, and thicknesses between 1.0 mm and 2.0 mm are mainly for stamped lead frames for high power devices. Also defines sampling methods, test procedures for verifying conformity to standard requirements, and delivery conditions.

ONORM EN 1758:1998 - Identical

DIN EN 1758 (1998-03) - Identical

BS EN 1758:1998 - Identical

SN EN 1758:1998 - Identical

NF EN 1758:1998 - Identical

UNE EN 1758:1998 - Identical

SS EN 1758 Ed. 1 (1998) - Identical

NS EN 1758 Ed. 1 (1998) - Identical

I.S. EN 1758:1998 - Identical

UNI EN 1758:1999 - Identical

NBN EN 1758:1998 - Identical