IPC SM 786:1995被替代
Procedures For Characterizing And Handling Of Moisture/reflow Sensitive Ics
出版：Institute of Printed Circuits
專家解讀視頻
基本信息
標準編號： IPC SM 786:1995
標準類別：Standard
出版單位：Institute of Printed Circuits
標準頁數(shù)：0
標準簡介
Pools the resources of component manufacturers and users to provide a cohesive problem statement and a consensus on what steps should be taken to prevent component cracking. Describes the extent of the problem within the industry, review its history, and discusses cracking failure modes. Provides recommendations on handling plastic chip carriers in order to reduce cracking problems. Also included is a test method that may be used to evaluate cracking susceptibility.
標準備注
classification criteria only is superseded by J-STD-020
