EN 60749-15 : 2010 COR 2011現行
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
出版：European Committee for Standards - Electrical
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基本信息
標準編號： EN 60749-15 : 2010 COR 2011
標準類別：Standard
出版單位：European Committee for Standards - Electrical
標準頁數：0
標準簡介
Specifies a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
