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MARKING PERMANENCY TEST METHOD
出版:International Electrotechnical Committee

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基本信息
標(biāo)準(zhǔn)編號(hào): IEC PAS 62175 : 1.0
發(fā)布時(shí)間:2000/8/24 0:00:00
標(biāo)準(zhǔn)類別:Standard
出版單位:International Electrotechnical Committee
標(biāo)準(zhǔn)頁數(shù):12
標(biāo)準(zhǔn)簡介
Verifies that the markings on solid state semiconductor devices will not become illegible when subjected to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process.
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