EIA JESD 22-B106:2008現行
Resistance To Solder Shock For Through-hole Mounted Devices
出版：JEDEC Solid State Technology Association
專家解讀視頻
基本信息
標準編號： EIA JESD 22-B106:2008
發布時間：2008/4/1 0:00:00
標準類別：Standard
出版單位：JEDEC Solid State Technology Association
標準頁數：0
標準簡介
Defines a procedure for determining whether through-hole solid state devices can withstand the effects of temperature to which they will be subjected during the soldering of their leads. The revision updates the references to current military standards.
標準備注
Supersedes EIA JESD 22 (07/2004)
本標準替代的舊標準
