
Lead Taping Of Components In The Radial Configuration For Automated Handling
出版:JEDEC Solid State Technology Association

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基本信息
標準編號: EIA 468:1994
發布時間:1994/8/12 0:00:00
標準類別:Standard
出版單位:JEDEC Solid State Technology Association
標準頁數:0
標準簡介
Describes lead taping for components with radial leads, disc, electrolytic and film capacitors and fixed inductors. May be used for taping other components providing procedure complies with Figure 1, Table 1 and noted requirements.
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